Indirect Bonding with a Thermal Cured Composite
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PII: S1073-8746(06)00067-3
doi:10.1053/j.sodo.2006.11.009
© 2007 Elsevier Inc. All rights reserved.
PII: S1073-8746(06)00067-3
doi:10.1053/j.sodo.2006.11.009
© 2007 Elsevier Inc. All rights reserved.